DL-TDC: Difference between revisions

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= DL-TDC DarkLight FPGA TDC =
= DL-TDC DarkLight FPGA TDC =


== ODB settings ==
= ODB settings =


* dl_enable - yes/no - enable or disable TDC readout in the midas frontend
* dl_enable - yes/no - enable or disable TDC readout in the midas frontend
Line 36: Line 36:
* dl_tdc_mask - 32 bits to enable 32 TDC channels, in sequence
* dl_tdc_mask - 32 bits to enable 32 TDC channels, in sequence


== Channel map ==
= Channel map =


<pre>
<pre>
Line 106: Line 106:
</pre>
</pre>


== D3 delay tuning ==
= D3 delay tuning =
 
* quartus report "DL trigger GPIO to dlA", "to dlB" and "through dlT"
* delay values are set in quartus assignements file. Delay values go from 0 to 7 in increments of about 0.5 ns.
<pre>
dsdaqgw:chronobox_firmware$ grep D3_DELAY *.qsf
DE10_NANO_SoC_GHRD.qsf:set_instance_assignment -name D3_DELAY 5 -to GPIO_1_21
</pre>


<pre>
<pre>
Line 146: Line 153:
</pre>
</pre>


= Cyclone-5 =
= Theory of operation =
 
== Why FPGA TDC? ==
 
* combine trigger logic, hit recording and time measurement in one device
* avoid having to split signals to FPGA trigger and to external TDC and to coordinate clocks and timestamps between them
* ability to construct custom TDC with data paths tuned to experiment requirements, i.e. ultra high data rates. this avoids the well known problem with the CERN TDC ASIC (V1190) where high rate on one channel will cause data loss on other channels.
* ability to get the data out at FPGA speeds, not limited to VME, USB or Ethernet speeds.
* ability to "right-size" the TDC. ASIC TDCs come in fixed increments: 96 channels (Lecroy Fastbus TDC), 64 or 128 channels (CAEN V1190 VME TDC), 64 channels (PicoTDC), overkill of fewer channels are actually needed. Compared to FPGA TDC where size (cost) of FPGA can be selected according to need and where FPGAs of different sizes often are available as interchangeable plug-in modules.
 
Downsides:
 
* ASIC TDC design can control internal timing much better than an FPGA TDC. as result per-time-bin and per-channel variations can be made much smaller.
* ASIC TDC can run at much higher clock frequencies and have much smaller time bins.
* ASIC TDC may have internal temperature compensation functions in order to avoid temperature drift of TDC calibration.
 
== Types of FPGA TDC ==
 
FPGA TDC come in two basic types: based on delay lines and based on the Vernier method. Delay line TDC resolution is limited to size and number of delay line elements. Vernier TDCs requires precise clock generators (usually not available on standard FPGA devices). Delay line TDCs have several designs. Delay line captures phase of input signal relative to the clock. Delay line captures phase of the clock relative to the input signal. Delay line encoder looks for 1 edge transition, or looks for many edge transitions ("wavelet TDC").
 
== Delay line FPGA TDC building blocks ==
 
* signal capture and clock synchronizer - asynchronous input signal is latched and synchronized to the TDC clock. Per-hit dead time (LE to next pulse), minimum pulse width requirement (LE to TE), minimum time double-pulse resolution (TE to next LE) are created here.
* tdc clock counter - latched and synchronized input signal records the hit coarse time (10 ns time bin)
* delay line - tdc clock (50 MHz/20 ns) waveform travels throught the 60-element delay line (~25 ns) total delay), latched input signal captures this waveform in the phase latch register (60 bits). Typical bit pattern: "00...000111...11100..000"
* "temperature encoder" - looks for the position of the first 0->1 or 1->0 transition and converts it into a time bin number 1..60 (for 0->1 transitions) and -1..-60 (for 1->0 transitions). This clock phase time bin number corresponds to the TDC fine time. After calibration that accounts for individual delay of each time bin.
* per-channel input buffer - 64 hits per channel for LE and TE (32 LE+TE hits), to handle bursts of hits
* main multiplexor - data from 32+3 TDC channels is funneled into 1 output stream
* main data FIFO - "the bigger, the better" data buffer to hold the data before it is transmitted out of the TDC
* data transmitter - DL-TDC uses a MIDAS frontend to read the main data FIFO via a 64-bit AXI bus, package data as MIDAS events and send them to the main computer via the Cyclone-5 SoC 1gige ethernet (data rate about 50 Mbytes/sec; at 8+8 bytes per TDC hit (LE+TE), about 3 Mhits/sec, sustained).
 
== Implementation details ==


* delay line element: use LCELL or cyclonev_lcell_comb (TDClcellff.sv), quartus fitter does not care which, does it's own thing regarding which LCELL input ports to use. Input "F" must be used for best timing (shortest delay): LUT mask: F0 = vcc 0xFFFF, F1 = vcc 0xFFFF, F2 = gnd 0x0000, F3 = gnd 0x0000, Combout equation: LCELL(F), [[Image:TDC_LCELL.pdf|150px|Cyclone-V logic cell]]
* delay line: in theory, 20 delay line elements can be packed in a 10-ALM block. In practice, to ensure routing uses LCELL input "F", TDC uses 8 delay elements per 10-ALM block. (quartus uses the "leftover" ALMs to implement the encoder and other logic). Typical timing reported by quartus is 0.087 ns transmit time through combinatorial logic from input F to COMBOUT output, 0.250 ns transit time to the next delay element inthe same 10-ALM block, 0.800 ns transmit time to the first delay element of the next 10-ALM block. [[Image:TDC_DELAY_CHAIN1.pdf|150px|one block of TDC delay chain]] and [[Image:TDC_DELAY_CHAIN2.pdf|150px|complete TDC delay chain]]
* timing of TDC delay chain for each TDC channel is shown in "Report DL-TDC-NN-{LE,TE}", use "Locate path" to "Locate path in chip planner", them zoom in and click in logic elements to examine the physical layout. Use "show routing" to see more detail of connection between logic elements.
* layout of the 60-element TDC delay line is done manually using quartus qsf file dltdc.qsf. This file is generated by a perl script (dltdc_qsf.perl). Location of each TDC channel is selected manually and must be adjusted to have them close to the FPGA input pins and to spread things around to avoid FPGA resource congestion.
<pre>
<pre>
report_path -multi_corner -panel_name {Report Path} -to [get_keepers {TDC6:TDC6_inst|TDC2ef:a|TDC2e:tdc|TDC1:le|TDClcell40:phase|TDClcell10:d|latch[9]}] -npaths 1
set_location_assignment LABCELL_X11_Y10_N6 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[0].c|lcell"
set_location_assignment FF_X11_Y10_N7 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[0].c|ff1"
set_location_assignment LABCELL_X11_Y10_N12 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[1].c|lcell"
set_location_assignment FF_X11_Y10_N13 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[1].c|ff1"
</pre>
</pre>
* Cyclone-V SoC FPGA on the DE-10 evaluation board comfortably fits 32+3 TDC channels with room to spare: [[Image:TDC_LAYOUT.pdf|150px|TDC layout]] (each TDC channel is shown in a different colour, explosion at the paint factory)
== TDC calibration ==
* the DL-TDC design uses the delay line for the clock and the latched hit signal to capture the clock phase. if TDC hits are uncorrelated with the TDC clock (i.e. cosmic rays or calibration pulser running from a different clock oscillator), we can assume a uniform distribution of TDC fine time (0 to 10 ns) and use the TDC fine time bin distribution to compute actual TDC delay line bin size and construct the mapping from TDC fine time bin (1..60) to TDC fine time (0..10 ns).
* calibration pulser run 286, TDC firmware 0x66dbbf18
* channel tdc00-LE fine time bin occupancy distribution: [[Image:TDC_TIME_BIN_OCCUPANCY.pdf|150px|TDC fine time bin occupancy]]
* fine time bin size (actual bin size is smaller than bin size computed by quartus because quartus must assume the worst possible FPGA timing): [[Image:TDC_TIME_BIN_SIZE.pdf|150px|TDC fine time bin occupancy]]
* typical TDC delay line size is 45-50 bins (out of 60 available), average time bins size 0.200..0.222 ns, actual computed typical bin size 0.180 ps (or so) with 5 or 6 extra-wide bins that correspond to TDC delay line transit from one block of logic elements to the next block of logic elements.
* for each run the fine time distribution is computed, if distortion from uniform 0..10 ns becomes too big, fine time calibration must be redone. [[Image:TDC_FINE_TIME.pdf|150px|TDC fine time distribution]]
* in addition to TDC delay line calibration, the TDC per-channel input delays must be calibrated. this is done by sending a common signal to all TDC inputs: [[Image:TDC_PULSER_LE.pdf|150px|TDC calibration pulser LE]]
== Future improvement 1 ==


<pre>
FPGA TDCs that use LCELL delay lines are unusual. Most FPGA TDCs reported on the literature use CARRY-chain delay lines.
2 TDCs, 40 LCELLs, region lock 3x3
 
Typical LCELL delay is 0.200 ns, typical CARRY delay is .050 ns (even for very old Cyclone-I FPGAs) and TDCs with much higher nominal resolution can be built.


21.108 21.108 data path 1
The trade-off between the two designs is the interplay between length of the delay line and frequency of the TDC fine clock. Slow clock and very fast delay line result in a very long delay line. Very long delay lines require edge ("temperature") encoders that use too many logic elements and this limits the number of channels that can be implemented in an FPGA of given size.
0.000   0.000 1 FF_X85_Y18_N2 tdc_ts[0] 1
0.000   0.000 RR CELL 9 FF_X85_Y18_N2 tdc_ts[0]|q 2
1.530   1.530 RR IC 1 MLABCELL_X87_Y10_N15 TDC6_inst|a|tdc|le|phase|a|inst0|dataf 3
1.617   0.087 RR CELL 2 MLABCELL_X87_Y10_N15 TDC6_inst|a|tdc|le|phase|a|inst0|combout 4
1.860   0.243 RR IC 1 MLABCELL_X87_Y10_N6 TDC6_inst|a|tdc|le|phase|a|inst1|dataf 5
1.946   0.086 RR CELL 2 MLABCELL_X87_Y10_N6 TDC6_inst|a|tdc|le|phase|a|inst1|combout 6
2.714   0.768 RR IC 1 LABCELL_X85_Y11_N51 TDC6_inst|a|tdc|le|phase|a|inst2|dataf 7
2.800   0.086 RR CELL 2 LABCELL_X85_Y11_N51 TDC6_inst|a|tdc|le|phase|a|inst2|combout 8
3.323   0.523 RR IC 1 LABCELL_X85_Y11_N48 TDC6_inst|a|tdc|le|phase|a|inst3|datad 9
3.576   0.253 RR CELL 2 LABCELL_X85_Y11_N48 TDC6_inst|a|tdc|le|phase|a|inst3|combout 10
3.827   0.251 RR IC 1 LABCELL_X85_Y11_N15 TDC6_inst|a|tdc|le|phase|a|inst4|dataf 11
3.914   0.087 RR CELL 2 LABCELL_X85_Y11_N15 TDC6_inst|a|tdc|le|phase|a|inst4|combout 12
4.146   0.232 RR IC 1 LABCELL_X85_Y11_N12 TDC6_inst|a|tdc|le|phase|a|inst5|dataf 13
4.233   0.087 RR CELL 2 LABCELL_X85_Y11_N12 TDC6_inst|a|tdc|le|phase|a|inst5|combout 14
4.484   0.251 RR IC 1 LABCELL_X85_Y11_N9 TDC6_inst|a|tdc|le|phase|a|inst6|dataf 15
4.571   0.087 RR CELL 2 LABCELL_X85_Y11_N9 TDC6_inst|a|tdc|le|phase|a|inst6|combout 16
4.800   0.229 RR IC 1 LABCELL_X85_Y11_N6 TDC6_inst|a|tdc|le|phase|a|inst7|dataf 17
4.887   0.087 RR CELL 2 LABCELL_X85_Y11_N6 TDC6_inst|a|tdc|le|phase|a|inst7|combout 18
5.124   0.237 RR IC 1 LABCELL_X85_Y11_N3 TDC6_inst|a|tdc|le|phase|a|inst8|dataf 19
5.211   0.087 RR CELL 2 LABCELL_X85_Y11_N3 TDC6_inst|a|tdc|le|phase|a|inst8|combout 20
5.459   0.248 RR IC 1 LABCELL_X85_Y11_N0 TDC6_inst|a|tdc|le|phase|a|inst9|datac 21
5.864   0.405 RR CELL 2 LABCELL_X85_Y11_N0 TDC6_inst|a|tdc|le|phase|a|inst9|combout 22
6.075   0.211 RR IC 1 LABCELL_X85_Y11_N27 TDC6_inst|a|tdc|le|phase|b|inst0|dataa 23
6.656   0.581 RR CELL 2 LABCELL_X85_Y11_N27 TDC6_inst|a|tdc|le|phase|b|inst0|combout 24
6.901   0.245 RR IC 1 LABCELL_X85_Y11_N24 TDC6_inst|a|tdc|le|phase|b|inst1|datac 25
7.306   0.405 RR CELL 2 LABCELL_X85_Y11_N24 TDC6_inst|a|tdc|le|phase|b|inst1|combout 26
7.552   0.246 RR IC 1 LABCELL_X85_Y11_N21 TDC6_inst|a|tdc|le|phase|b|inst2|dataf 27
7.639   0.087 RR CELL 2 LABCELL_X85_Y11_N21 TDC6_inst|a|tdc|le|phase|b|inst2|combout 28
7.886   0.247 RR IC 1 LABCELL_X85_Y11_N18 TDC6_inst|a|tdc|le|phase|b|inst3|datac 29
8.291   0.405 RR CELL 2 LABCELL_X85_Y11_N18 TDC6_inst|a|tdc|le|phase|b|inst3|combout 30
8.548   0.257 RR IC 1 LABCELL_X85_Y11_N45 TDC6_inst|a|tdc|le|phase|b|inst4|dataf 31
8.635   0.087 RR CELL 2 LABCELL_X85_Y11_N45 TDC6_inst|a|tdc|le|phase|b|inst4|combout 32
8.839   0.204 RR IC 1 LABCELL_X85_Y11_N42 TDC6_inst|a|tdc|le|phase|b|inst5|datab 33
9.394   0.555 RR CELL 2 LABCELL_X85_Y11_N42 TDC6_inst|a|tdc|le|phase|b|inst5|combout 34
9.638   0.244 RR IC 1 LABCELL_X85_Y11_N39 TDC6_inst|a|tdc|le|phase|b|inst6|dataf 35
9.725   0.087 RR CELL 2 LABCELL_X85_Y11_N39 TDC6_inst|a|tdc|le|phase|b|inst6|combout 36
9.959   0.234 RR IC 1 LABCELL_X85_Y11_N36 TDC6_inst|a|tdc|le|phase|b|inst7|dataf 37
10.046   0.087 RR CELL 2 LABCELL_X85_Y11_N36 TDC6_inst|a|tdc|le|phase|b|inst7|combout 38
10.250   0.204 RR IC 1 LABCELL_X85_Y11_N33 TDC6_inst|a|tdc|le|phase|b|inst8|dataa 39
10.831   0.581 RR CELL 2 LABCELL_X85_Y11_N33 TDC6_inst|a|tdc|le|phase|b|inst8|combout 40
11.059   0.228 RR IC 1 LABCELL_X85_Y11_N30 TDC6_inst|a|tdc|le|phase|b|inst9|dataf 41
11.145   0.086 RR CELL 2 LABCELL_X85_Y11_N30 TDC6_inst|a|tdc|le|phase|b|inst9|combout 42
11.724   0.579 RR IC 1 LABCELL_X88_Y11_N57 TDC6_inst|a|tdc|le|phase|c|inst0|dataf 43
11.811   0.087 RR CELL 2 LABCELL_X88_Y11_N57 TDC6_inst|a|tdc|le|phase|c|inst0|combout 44
12.018   0.207 RR IC 1 LABCELL_X88_Y11_N54 TDC6_inst|a|tdc|le|phase|c|inst1|datab 45
12.573   0.555 RR CELL 2 LABCELL_X88_Y11_N54 TDC6_inst|a|tdc|le|phase|c|inst1|combout 46
12.780   0.207 RR IC 1 LABCELL_X88_Y11_N51 TDC6_inst|a|tdc|le|phase|c|inst2|dataa 47
13.361   0.581 RR CELL 2 LABCELL_X88_Y11_N51 TDC6_inst|a|tdc|le|phase|c|inst2|combout 48
13.591   0.230 RR IC 1 LABCELL_X88_Y11_N48 TDC6_inst|a|tdc|le|phase|c|inst3|dataf 49
13.678   0.087 RR CELL 2 LABCELL_X88_Y11_N48 TDC6_inst|a|tdc|le|phase|c|inst3|combout 50
13.935   0.257 RR IC 1 LABCELL_X88_Y11_N15 TDC6_inst|a|tdc|le|phase|c|inst4|dataf 51
14.022   0.087 RR CELL 2 LABCELL_X88_Y11_N15 TDC6_inst|a|tdc|le|phase|c|inst4|combout 52
14.254   0.232 RR IC 1 LABCELL_X88_Y11_N12 TDC6_inst|a|tdc|le|phase|c|inst5|dataf 53
14.341   0.087 RR CELL 2 LABCELL_X88_Y11_N12 TDC6_inst|a|tdc|le|phase|c|inst5|combout 54
14.592   0.251 RR IC 1 LABCELL_X88_Y11_N9 TDC6_inst|a|tdc|le|phase|c|inst6|dataf 55
14.679   0.087 RR CELL 2 LABCELL_X88_Y11_N9 TDC6_inst|a|tdc|le|phase|c|inst6|combout 56
14.908   0.229 RR IC 1 LABCELL_X88_Y11_N6 TDC6_inst|a|tdc|le|phase|c|inst7|dataf 57
14.995   0.087 RR CELL 2 LABCELL_X88_Y11_N6 TDC6_inst|a|tdc|le|phase|c|inst7|combout 58
15.247   0.252 RR IC 1 LABCELL_X88_Y11_N33 TDC6_inst|a|tdc|le|phase|c|inst8|dataf 59
15.334   0.087 RR CELL 2 LABCELL_X88_Y11_N33 TDC6_inst|a|tdc|le|phase|c|inst8|combout 60
15.568   0.234 RR IC 1 LABCELL_X88_Y11_N30 TDC6_inst|a|tdc|le|phase|c|inst9|dataf 61
15.655   0.087 RR CELL 2 LABCELL_X88_Y11_N30 TDC6_inst|a|tdc|le|phase|c|inst9|combout 62
15.909   0.254 RR IC 1 LABCELL_X88_Y11_N27 TDC6_inst|a|tdc|le|phase|d|inst0|dataf 63
15.996   0.087 RR CELL 2 LABCELL_X88_Y11_N27 TDC6_inst|a|tdc|le|phase|d|inst0|combout 64
16.241   0.245 RR IC 1 LABCELL_X88_Y11_N24 TDC6_inst|a|tdc|le|phase|d|inst1|datac 65
16.646   0.405 RR CELL 2 LABCELL_X88_Y11_N24 TDC6_inst|a|tdc|le|phase|d|inst1|combout 66
16.892   0.246 RR IC 1 LABCELL_X88_Y11_N21 TDC6_inst|a|tdc|le|phase|d|inst2|dataf 67
16.979   0.087 RR CELL 2 LABCELL_X88_Y11_N21 TDC6_inst|a|tdc|le|phase|d|inst2|combout 68
17.226   0.247 RR IC 1 LABCELL_X88_Y11_N18 TDC6_inst|a|tdc|le|phase|d|inst3|datac 69
17.631   0.405 RR CELL 2 LABCELL_X88_Y11_N18 TDC6_inst|a|tdc|le|phase|d|inst3|combout 70
17.888   0.257 RR IC 1 LABCELL_X88_Y11_N45 TDC6_inst|a|tdc|le|phase|d|inst4|dataf 71
17.975   0.087 RR CELL 2 LABCELL_X88_Y11_N45 TDC6_inst|a|tdc|le|phase|d|inst4|combout 72
18.185   0.210 RR IC 1 LABCELL_X88_Y11_N42 TDC6_inst|a|tdc|le|phase|d|inst5|datab 73
18.740   0.555 RR CELL 2 LABCELL_X88_Y11_N42 TDC6_inst|a|tdc|le|phase|d|inst5|combout 74
18.984   0.244 RR IC 1 LABCELL_X88_Y11_N39 TDC6_inst|a|tdc|le|phase|d|inst6|dataf 75
19.071   0.087 RR CELL 2 LABCELL_X88_Y11_N39 TDC6_inst|a|tdc|le|phase|d|inst6|combout 76
19.305   0.234 RR IC 1 LABCELL_X88_Y11_N36 TDC6_inst|a|tdc|le|phase|d|inst7|dataf 77
19.392   0.087 RR CELL 2 LABCELL_X88_Y11_N36 TDC6_inst|a|tdc|le|phase|d|inst7|combout 78
19.618   0.226 RR IC 1 LABCELL_X88_Y11_N3 TDC6_inst|a|tdc|le|phase|d|inst8|dataa 79
20.199   0.581 RR CELL 2 LABCELL_X88_Y11_N3 TDC6_inst|a|tdc|le|phase|d|inst8|combout 80
20.447   0.248 RR IC 1 LABCELL_X88_Y11_N0 TDC6_inst|a|tdc|le|phase|d|inst9|datac 81
20.847   0.000 RR IC 1 FF_X88_Y11_N2 TDC6_inst|a|tdc|le|phase|d|latch[9]|d 82
20.847   0.400 RR CELL 1 LABCELL_X88_Y11_N0 TDC6_inst|a|tdc|le|phase|d|inst9|combout 83
21.108   0.261 RR CELL 1 FF_X88_Y11_N2 TDC6:TDC6_inst|TDC2ef:a|TDC2e:tdc|TDC1:le|TDClcell40:phase|TDClcell10:d|latch[9] 84


tdc6g.pdf
The DL-TDC uses a 100 MHz fine time clock which is typical of FPGA logic designs used at TRIUMF (i.e. state of the art DarkSide FPGA logic runs only just faster at 125 MHz). Coupled with 0.200 ns LCELL delay this yields 50-60 element delay lines that comfortably fit inside the FPGA and use encoders that need only 1 level of pipelining to meet the timing. FPGA compilation time is 20 minutes (AMD 7700 CPU with DDR5 memory). A well balanced design. The fairly low time resolution (0.2 ns time bin vs 0.1 ns time bin of very old V1190 TDC) is deemed adequate to resolve the 1.5 ns e-linac bunches.


min bin: 0.021 0.016 0.031 0.030 ns, max bin: 0.484 0.612 0.872 1.171 ns, max phase 38 36 33 33
For better time resolution a CARRY chain TDC must be developed:
min bin: 0.016 0.074 0.009 0.130 ns, max bin: 0.857 0.727 0.622 0.782 ns, max phase 33 30 38 35
* faster TDC fine clock, 200-500 MHz
</pre>
* keep delay line length under 50-60 time bins
* keep the TDC back-end (endoder, data buffers, multiplexors) on the TDC slow clock (100-125 MHz)


<pre>
== Future improvement 2 ==
6 TDCs, 40 LCELLs, region lock floating


21.415 21.415 data path 1
The Cyclone-V SoC FPGA is now very old and is no longer a flagship at Altera (now Intel). It is still available, but for how long? Better, bigger, faster FPGAs are now available.
0.000   0.000 1 FF_X72_Y13_N2 tdc_ts[0] 1
0.000   0.000 RR CELL 25 FF_X72_Y13_N2 tdc_ts[0]|q 2
1.788   1.788 RR IC 1 MLABCELL_X84_Y1_N9 TDC6_inst|a|tdc|le|phase|a|inst0|dataf 3
1.874   0.086 RR CELL 2 MLABCELL_X84_Y1_N9 TDC6_inst|a|tdc|le|phase|a|inst0|combout 4
2.436   0.562 RR IC 1 MLABCELL_X87_Y1_N9 TDC6_inst|a|tdc|le|phase|a|inst1|datac 5
2.865   0.429 RR CELL 2 MLABCELL_X87_Y1_N9 TDC6_inst|a|tdc|le|phase|a|inst1|combout 6
3.142   0.277 RR IC 1 MLABCELL_X87_Y1_N33 TDC6_inst|a|tdc|le|phase|a|inst2|dataf 7
3.229   0.087 RR CELL 2 MLABCELL_X87_Y1_N33 TDC6_inst|a|tdc|le|phase|a|inst2|combout 8
3.458   0.229 RR IC 1 MLABCELL_X87_Y1_N30 TDC6_inst|a|tdc|le|phase|a|inst3|dataf 9
3.545   0.087 RR CELL 2 MLABCELL_X87_Y1_N30 TDC6_inst|a|tdc|le|phase|a|inst3|combout 10
3.795   0.250 RR IC 1 MLABCELL_X87_Y1_N57 TDC6_inst|a|tdc|le|phase|a|inst4|dataf 11
3.882   0.087 RR CELL 2 MLABCELL_X87_Y1_N57 TDC6_inst|a|tdc|le|phase|a|inst4|combout 12
4.084   0.202 RR IC 1 MLABCELL_X87_Y1_N54 TDC6_inst|a|tdc|le|phase|a|inst5|datab 13
4.639   0.555 RR CELL 2 MLABCELL_X87_Y1_N54 TDC6_inst|a|tdc|le|phase|a|inst5|combout 14
4.848   0.209 RR IC 1 MLABCELL_X87_Y1_N51 TDC6_inst|a|tdc|le|phase|a|inst6|dataa 15
5.429   0.581 RR CELL 2 MLABCELL_X87_Y1_N51 TDC6_inst|a|tdc|le|phase|a|inst6|combout 16
5.662   0.233 RR IC 1 MLABCELL_X87_Y1_N48 TDC6_inst|a|tdc|le|phase|a|inst7|dataf 17
5.749   0.087 RR CELL 2 MLABCELL_X87_Y1_N48 TDC6_inst|a|tdc|le|phase|a|inst7|combout 18
6.008   0.259 RR IC 1 MLABCELL_X87_Y1_N15 TDC6_inst|a|tdc|le|phase|a|inst8|dataf 19
6.095   0.087 RR CELL 2 MLABCELL_X87_Y1_N15 TDC6_inst|a|tdc|le|phase|a|inst8|combout 20
6.328   0.233 RR IC 1 MLABCELL_X87_Y1_N12 TDC6_inst|a|tdc|le|phase|a|inst9|dataf 21
6.415   0.087 RR CELL 2 MLABCELL_X87_Y1_N12 TDC6_inst|a|tdc|le|phase|a|inst9|combout 22
6.678   0.263 RR IC 1 MLABCELL_X87_Y1_N39 TDC6_inst|a|tdc|le|phase|b|inst0|dataf 23
6.765   0.087 RR CELL 2 MLABCELL_X87_Y1_N39 TDC6_inst|a|tdc|le|phase|b|inst0|combout 24
6.995   0.230 RR IC 1 MLABCELL_X87_Y1_N36 TDC6_inst|a|tdc|le|phase|b|inst1|dataf 25
7.082   0.087 RR CELL 2 MLABCELL_X87_Y1_N36 TDC6_inst|a|tdc|le|phase|b|inst1|combout 26
7.328   0.246 RR IC 1 MLABCELL_X87_Y1_N3 TDC6_inst|a|tdc|le|phase|b|inst2|datae 27
7.535   0.207 RR CELL 2 MLABCELL_X87_Y1_N3 TDC6_inst|a|tdc|le|phase|b|inst2|combout 28
8.070   0.535 RR IC 1 LABCELL_X85_Y1_N12 TDC6_inst|a|tdc|le|phase|b|inst3|dataf 29
8.157   0.087 RR CELL 2 LABCELL_X85_Y1_N12 TDC6_inst|a|tdc|le|phase|b|inst3|combout 30
8.412   0.255 RR IC 1 LABCELL_X85_Y1_N39 TDC6_inst|a|tdc|le|phase|b|inst4|dataf 31
8.499   0.087 RR CELL 2 LABCELL_X85_Y1_N39 TDC6_inst|a|tdc|le|phase|b|inst4|combout 32
8.745   0.246 RR IC 1 LABCELL_X85_Y1_N51 TDC6_inst|a|tdc|le|phase|b|inst5|dataf 33
8.832   0.087 RR CELL 2 LABCELL_X85_Y1_N51 TDC6_inst|a|tdc|le|phase|b|inst5|combout 34
9.083   0.251 RR IC 1 LABCELL_X85_Y1_N9 TDC6_inst|a|tdc|le|phase|b|inst6|dataf 35
9.170   0.087 RR CELL 2 LABCELL_X85_Y1_N9 TDC6_inst|a|tdc|le|phase|b|inst6|combout 36
9.405   0.235 RR IC 1 LABCELL_X85_Y1_N6 TDC6_inst|a|tdc|le|phase|b|inst7|dataf 37
9.491   0.086 RR CELL 2 LABCELL_X85_Y1_N6 TDC6_inst|a|tdc|le|phase|b|inst7|combout 38
9.840   0.349 RR IC 1 LABCELL_X85_Y1_N33 TDC6_inst|a|tdc|le|phase|b|inst8|dataa 39
10.421   0.581 RR CELL 2 LABCELL_X85_Y1_N33 TDC6_inst|a|tdc|le|phase|b|inst8|combout 40
10.655   0.234 RR IC 1 LABCELL_X85_Y1_N30 TDC6_inst|a|tdc|le|phase|b|inst9|dataf 41
10.742   0.087 RR CELL 2 LABCELL_X85_Y1_N30 TDC6_inst|a|tdc|le|phase|b|inst9|combout 42
10.993   0.251 RR IC 1 LABCELL_X85_Y1_N57 TDC6_inst|a|tdc|le|phase|c|inst0|dataf 43
11.080   0.087 RR CELL 2 LABCELL_X85_Y1_N57 TDC6_inst|a|tdc|le|phase|c|inst0|combout 44
11.294   0.214 RR IC 1 LABCELL_X85_Y1_N48 TDC6_inst|a|tdc|le|phase|c|inst1|datab 45
11.849   0.555 RR CELL 2 LABCELL_X85_Y1_N48 TDC6_inst|a|tdc|le|phase|c|inst1|combout 46
12.087   0.238 RR IC 1 LABCELL_X85_Y1_N42 TDC6_inst|a|tdc|le|phase|c|inst2|dataf 47
12.173   0.086 RR CELL 2 LABCELL_X85_Y1_N42 TDC6_inst|a|tdc|le|phase|c|inst2|combout 48
12.504   0.331 RR IC 1 MLABCELL_X84_Y1_N57 TDC6_inst|a|tdc|le|phase|c|inst3|datae 49
12.713   0.209 RR CELL 2 MLABCELL_X84_Y1_N57 TDC6_inst|a|tdc|le|phase|c|inst3|combout 50
12.949   0.236 RR IC 1 MLABCELL_X84_Y1_N51 TDC6_inst|a|tdc|le|phase|c|inst4|datac 51
13.361   0.412 RR CELL 2 MLABCELL_X84_Y1_N51 TDC6_inst|a|tdc|le|phase|c|inst4|combout 52
13.595   0.234 RR IC 1 MLABCELL_X84_Y1_N48 TDC6_inst|a|tdc|le|phase|c|inst5|dataf 53
13.682   0.087 RR CELL 2 MLABCELL_X84_Y1_N48 TDC6_inst|a|tdc|le|phase|c|inst5|combout 54
13.935   0.253 RR IC 1 MLABCELL_X84_Y1_N45 TDC6_inst|a|tdc|le|phase|c|inst6|dataf 55
14.021   0.086 RR CELL 2 MLABCELL_X84_Y1_N45 TDC6_inst|a|tdc|le|phase|c|inst6|combout 56
14.329   0.308 RR IC 1 LABCELL_X85_Y1_N36 TDC6_inst|a|tdc|le|phase|c|inst7|dataf 57
14.416   0.087 RR CELL 2 LABCELL_X85_Y1_N36 TDC6_inst|a|tdc|le|phase|c|inst7|combout 58
14.635   0.219 RR IC 1 LABCELL_X85_Y1_N3 TDC6_inst|a|tdc|le|phase|c|inst8|dataa 59
15.219   0.584 RR CELL 2 LABCELL_X85_Y1_N3 TDC6_inst|a|tdc|le|phase|c|inst8|combout 60
15.461   0.242 RR IC 1 LABCELL_X85_Y1_N0 TDC6_inst|a|tdc|le|phase|c|inst9|datac 61
15.864   0.403 RR CELL 2 LABCELL_X85_Y1_N0 TDC6_inst|a|tdc|le|phase|c|inst9|combout 62
16.180   0.316 RR IC 1 MLABCELL_X84_Y1_N39 TDC6_inst|a|tdc|le|phase|d|inst0|dataa 63
16.761   0.581 RR CELL 2 MLABCELL_X84_Y1_N39 TDC6_inst|a|tdc|le|phase|d|inst0|combout 64
16.996   0.235 RR IC 1 MLABCELL_X84_Y1_N36 TDC6_inst|a|tdc|le|phase|d|inst1|dataf 65
17.083   0.087 RR CELL 2 MLABCELL_X84_Y1_N36 TDC6_inst|a|tdc|le|phase|d|inst1|combout 66
17.302   0.219 RR IC 1 MLABCELL_X84_Y1_N3 TDC6_inst|a|tdc|le|phase|d|inst2|dataa 67
17.883   0.581 RR CELL 2 MLABCELL_X84_Y1_N3 TDC6_inst|a|tdc|le|phase|d|inst2|combout 68
18.125   0.242 RR IC 1 MLABCELL_X84_Y1_N33 TDC6_inst|a|tdc|le|phase|d|inst3|datae 69
18.334   0.209 RR CELL 2 MLABCELL_X84_Y1_N33 TDC6_inst|a|tdc|le|phase|d|inst3|combout 70
18.594   0.260 RR IC 1 MLABCELL_X84_Y1_N12 TDC6_inst|a|tdc|le|phase|d|inst4|datac 71
19.022   0.428 RR CELL 2 MLABCELL_X84_Y1_N12 TDC6_inst|a|tdc|le|phase|d|inst4|combout 72
19.264   0.242 RR IC 1 MLABCELL_X84_Y1_N27 TDC6_inst|a|tdc|le|phase|d|inst5|datac 73
19.676   0.412 RR CELL 2 MLABCELL_X84_Y1_N27 TDC6_inst|a|tdc|le|phase|d|inst5|combout 74
19.924   0.248 RR IC 1 MLABCELL_X84_Y1_N18 TDC6_inst|a|tdc|le|phase|d|inst6|datae 75
20.175   0.251 RR CELL 2 MLABCELL_X84_Y1_N18 TDC6_inst|a|tdc|le|phase|d|inst6|combout 76
20.421   0.246 RR IC 1 MLABCELL_X84_Y1_N24 TDC6_inst|a|tdc|le|phase|d|inst7|dataf 77
20.508   0.087 RR CELL 2 MLABCELL_X84_Y1_N24 TDC6_inst|a|tdc|le|phase|d|inst7|combout 78
20.757   0.249 RR IC 1 MLABCELL_X84_Y1_N6 TDC6_inst|a|tdc|le|phase|d|inst8|dataf 79
20.844   0.087 RR CELL 2 MLABCELL_X84_Y1_N6 TDC6_inst|a|tdc|le|phase|d|inst8|combout 80
21.070   0.226 RR IC 1 MLABCELL_X84_Y1_N0 TDC6_inst|a|tdc|le|phase|d|inst9|dataf 81
21.153   0.000 RR IC 1 FF_X84_Y1_N2 TDC6_inst|a|tdc|le|phase|d|latch[9]|d 82
21.153   0.083 RR CELL 1 MLABCELL_X84_Y1_N0 TDC6_inst|a|tdc|le|phase|d|inst9|combout 83
21.415   0.262 RR CELL 1 FF_X84_Y1_N2 TDC6:TDC6_inst|TDC2ef:a|TDC2e:tdc|TDC1:le|TDClcell40:phase|TDClcell10:d|latch[9] 84


tdc6h.pdf
Next step would be to finish converting the TDC design to system-verilog and to port it to the Xilinx FPGA architecture.


min bin: 0.060 0.064 0.061 0.063 ns, max bin: 0.783 0.962 0.736 0.755 ns, max phase 36 34 35 34
== Secret Sauce ==
min bin: 0.058 0.067 0.061 0.063 ns, max bin: 0.872 0.800 0.671 0.759 ns, max phase 35 31 36 34
min bin: 0.062 0.062 0.062 0.062 ns, max bin: 0.617 0.625 0.741 0.688 ns, max phase 36 33 39 35
min bin: 0.061 0.064 0.061 0.064 ns, max bin: 0.727 1.083 0.727 0.764 ns, max phase 38 35 38 35
min bin: 0.058 0.067 0.062 0.062 ns, max bin: 0.698 0.800 0.741 0.750 ns, max phase 38 35 38 36
min bin: 0.059 0.065 0.062 0.062 ns, max bin: 0.888 0.980 0.617 0.750 ns, max phase 39 36 39 36
</pre>


<pre>
Yea, right. Ask me.
interim 80 LCELL
22.127 22.127 data path
0.000   0.000 1 FF_X72_Y17_N2 tdc_ts[0]
0.000   0.000 FF CELL 71 FF_X72_Y17_N2 tdc_ts[0]|q
1.955   1.955 FF IC 1 LABCELL_X48_Y13_N27 tdcs|tdc[0].tdc|tdc|le|phase|a|inst0|dataf
2.038   0.083 FF CELL 2 LABCELL_X48_Y13_N27 tdcs|tdc[0].tdc|tdc|le|phase|a|inst0|combout
2.257   0.219 FF IC 1 LABCELL_X48_Y13_N24 tdcs|tdc[0].tdc|tdc|le|phase|a|inst1|datad
2.613   0.356 FF CELL 2 LABCELL_X48_Y13_N24 tdcs|tdc[0].tdc|tdc|le|phase|a|inst1|combout
2.833   0.220 FF IC 1 LABCELL_X48_Y13_N21 tdcs|tdc[0].tdc|tdc|le|phase|a|inst2|dataf
2.912   0.079 FF CELL 2 LABCELL_X48_Y13_N21 tdcs|tdc[0].tdc|tdc|le|phase|a|inst2|combout
3.248   0.336 FF IC 1 LABCELL_X48_Y13_N18 tdcs|tdc[0].tdc|tdc|le|phase|a|inst3|dataf
3.330   0.082 FF CELL 2 LABCELL_X48_Y13_N18 tdcs|tdc[0].tdc|tdc|le|phase|a|inst3|combout
3.554   0.224 FF IC 1 LABCELL_X48_Y13_N15 tdcs|tdc[0].tdc|tdc|le|phase|a|inst4|dataf
3.633   0.079 FF CELL 2 LABCELL_X48_Y13_N15 tdcs|tdc[0].tdc|tdc|le|phase|a|inst4|combout
3.958   0.325 FF IC 1 LABCELL_X48_Y13_N12 tdcs|tdc[0].tdc|tdc|le|phase|a|inst5|dataf
4.040   0.082 FF CELL 2 LABCELL_X48_Y13_N12 tdcs|tdc[0].tdc|tdc|le|phase|a|inst5|combout
4.257   0.217 FF IC 1 LABCELL_X48_Y13_N9 tdcs|tdc[0].tdc|tdc|le|phase|a|inst6|dataf
4.337   0.080 FF CELL 2 LABCELL_X48_Y13_N9 tdcs|tdc[0].tdc|tdc|le|phase|a|inst6|combout
4.546   0.209 FF IC 1 LABCELL_X48_Y13_N6 tdcs|tdc[0].tdc|tdc|le|phase|a|inst7|dataf
4.628   0.082 FF CELL 2 LABCELL_X48_Y13_N6 tdcs|tdc[0].tdc|tdc|le|phase|a|inst7|combout
4.857   0.229 FF IC 1 LABCELL_X48_Y13_N33 tdcs|tdc[0].tdc|tdc|le|phase|a|inst8|dataf
4.937   0.080 FF CELL 2 LABCELL_X48_Y13_N33 tdcs|tdc[0].tdc|tdc|le|phase|a|inst8|combout
5.142   0.205 FF IC 1 LABCELL_X48_Y13_N30 tdcs|tdc[0].tdc|tdc|le|phase|a|inst9|dataf
5.224   0.082 FF CELL 2 LABCELL_X48_Y13_N30 tdcs|tdc[0].tdc|tdc|le|phase|a|inst9|combout
5.463   0.239 FF IC 1 LABCELL_X48_Y13_N57 tdcs|tdc[0].tdc|tdc|le|phase|b|inst0|dataf
5.542   0.079 FF CELL 2 LABCELL_X48_Y13_N57 tdcs|tdc[0].tdc|tdc|le|phase|b|inst0|combout
5.842   0.300 FF IC 1 LABCELL_X48_Y13_N54 tdcs|tdc[0].tdc|tdc|le|phase|b|inst1|dataf
5.926   0.084 FF CELL 2 LABCELL_X48_Y13_N54 tdcs|tdc[0].tdc|tdc|le|phase|b|inst1|combout
6.141   0.215 FF IC 1 LABCELL_X48_Y13_N51 tdcs|tdc[0].tdc|tdc|le|phase|b|inst2|datad
6.523   0.382 FF CELL 2 LABCELL_X48_Y13_N51 tdcs|tdc[0].tdc|tdc|le|phase|b|inst2|combout
6.729   0.206 FF IC 1 LABCELL_X48_Y13_N48 tdcs|tdc[0].tdc|tdc|le|phase|b|inst3|dataf
6.811   0.082 FF CELL 2 LABCELL_X48_Y13_N48 tdcs|tdc[0].tdc|tdc|le|phase|b|inst3|combout
7.036   0.225 FF IC 1 LABCELL_X48_Y13_N45 tdcs|tdc[0].tdc|tdc|le|phase|b|inst4|dataf
7.116   0.080 FF CELL 2 LABCELL_X48_Y13_N45 tdcs|tdc[0].tdc|tdc|le|phase|b|inst4|combout
7.329   0.213 FF IC 1 LABCELL_X48_Y13_N42 tdcs|tdc[0].tdc|tdc|le|phase|b|inst5|datad
7.682   0.353 FF CELL 2 LABCELL_X48_Y13_N42 tdcs|tdc[0].tdc|tdc|le|phase|b|inst5|combout
7.907   0.225 FF IC 1 LABCELL_X48_Y13_N39 tdcs|tdc[0].tdc|tdc|le|phase|b|inst6|dataf
7.987   0.080 FF CELL 2 LABCELL_X48_Y13_N39 tdcs|tdc[0].tdc|tdc|le|phase|b|inst6|combout
8.203   0.216 FF IC 1 LABCELL_X48_Y13_N36 tdcs|tdc[0].tdc|tdc|le|phase|b|inst7|dataf
8.285   0.082 FF CELL 2 LABCELL_X48_Y13_N36 tdcs|tdc[0].tdc|tdc|le|phase|b|inst7|combout
8.524   0.239 FF IC 1 LABCELL_X48_Y13_N3 tdcs|tdc[0].tdc|tdc|le|phase|b|inst8|datad
8.906   0.382 FF CELL 2 LABCELL_X48_Y13_N3 tdcs|tdc[0].tdc|tdc|le|phase|b|inst8|combout
9.117   0.211 FF IC 1 LABCELL_X48_Y13_N0 tdcs|tdc[0].tdc|tdc|le|phase|b|inst9|datad
9.468   0.351 FF CELL 2 LABCELL_X48_Y13_N0 tdcs|tdc[0].tdc|tdc|le|phase|b|inst9|combout
10.043   0.575 FF IC 1 LABCELL_X48_Y11_N57 tdcs|tdc[0].tdc|tdc|le|phase|c|inst0|dataf
10.122   0.079 FF CELL 2 LABCELL_X48_Y11_N57 tdcs|tdc[0].tdc|tdc|le|phase|c|inst0|combout
10.417   0.295 FF IC 1 LABCELL_X48_Y11_N54 tdcs|tdc[0].tdc|tdc|le|phase|c|inst1|dataf
10.499   0.082 FF CELL 2 LABCELL_X48_Y11_N54 tdcs|tdc[0].tdc|tdc|le|phase|c|inst1|combout
10.718   0.219 FF IC 1 LABCELL_X48_Y11_N21 tdcs|tdc[0].tdc|tdc|le|phase|c|inst2|datad
11.098   0.380 FF CELL 2 LABCELL_X48_Y11_N21 tdcs|tdc[0].tdc|tdc|le|phase|c|inst2|combout
11.434   0.336 FF IC 1 LABCELL_X48_Y11_N18 tdcs|tdc[0].tdc|tdc|le|phase|c|inst3|dataf
11.515   0.081 FF CELL 2 LABCELL_X48_Y11_N18 tdcs|tdc[0].tdc|tdc|le|phase|c|inst3|combout
12.094   0.579 FF IC 1 LABCELL_X48_Y11_N45 tdcs|tdc[0].tdc|tdc|le|phase|c|inst4|dataf
12.174   0.080 FF CELL 2 LABCELL_X48_Y11_N45 tdcs|tdc[0].tdc|tdc|le|phase|c|inst4|combout
12.387   0.213 FF IC 1 LABCELL_X48_Y11_N42 tdcs|tdc[0].tdc|tdc|le|phase|c|inst5|datad
12.740   0.353 FF CELL 2 LABCELL_X48_Y11_N42 tdcs|tdc[0].tdc|tdc|le|phase|c|inst5|combout
12.965   0.225 FF IC 1 LABCELL_X48_Y11_N39 tdcs|tdc[0].tdc|tdc|le|phase|c|inst6|dataf
13.045   0.080 FF CELL 2 LABCELL_X48_Y11_N39 tdcs|tdc[0].tdc|tdc|le|phase|c|inst6|combout
13.261   0.216 FF IC 1 LABCELL_X48_Y11_N36 tdcs|tdc[0].tdc|tdc|le|phase|c|inst7|dataf
13.343   0.082 FF CELL 2 LABCELL_X48_Y11_N36 tdcs|tdc[0].tdc|tdc|le|phase|c|inst7|combout
13.561   0.218 FF IC 1 LABCELL_X48_Y11_N33 tdcs|tdc[0].tdc|tdc|le|phase|c|inst8|datad
13.943   0.382 FF CELL 2 LABCELL_X48_Y11_N33 tdcs|tdc[0].tdc|tdc|le|phase|c|inst8|combout
14.148   0.205 FF IC 1 LABCELL_X48_Y11_N30 tdcs|tdc[0].tdc|tdc|le|phase|c|inst9|dataf
14.230   0.082 FF CELL 2 LABCELL_X48_Y11_N30 tdcs|tdc[0].tdc|tdc|le|phase|c|inst9|combout
14.465   0.235 FF IC 1 LABCELL_X48_Y11_N27 tdcs|tdc[0].tdc|tdc|le|phase|d|inst0|dataf
14.544   0.079 FF CELL 2 LABCELL_X48_Y11_N27 tdcs|tdc[0].tdc|tdc|le|phase|d|inst0|combout
14.848   0.304 FF IC 1 LABCELL_X48_Y11_N24 tdcs|tdc[0].tdc|tdc|le|phase|d|inst1|dataf
14.930   0.082 FF CELL 2 LABCELL_X48_Y11_N24 tdcs|tdc[0].tdc|tdc|le|phase|d|inst1|combout
15.146   0.216 FF IC 1 LABCELL_X48_Y11_N51 tdcs|tdc[0].tdc|tdc|le|phase|d|inst2|dataf
15.226   0.080 FF CELL 2 LABCELL_X48_Y11_N51 tdcs|tdc[0].tdc|tdc|le|phase|d|inst2|combout
15.431   0.205 FF IC 1 LABCELL_X48_Y11_N48 tdcs|tdc[0].tdc|tdc|le|phase|d|inst3|dataf
15.513   0.082 FF CELL 2 LABCELL_X48_Y11_N48 tdcs|tdc[0].tdc|tdc|le|phase|d|inst3|combout
15.750   0.237 FF IC 1 LABCELL_X48_Y11_N15 tdcs|tdc[0].tdc|tdc|le|phase|d|inst4|dataf
15.830   0.080 FF CELL 2 LABCELL_X48_Y11_N15 tdcs|tdc[0].tdc|tdc|le|phase|d|inst4|combout
16.036   0.206 FF IC 1 LABCELL_X48_Y11_N12 tdcs|tdc[0].tdc|tdc|le|phase|d|inst5|dataf
16.118   0.082 FF CELL 2 LABCELL_X48_Y11_N12 tdcs|tdc[0].tdc|tdc|le|phase|d|inst5|combout
16.342   0.224 FF IC 1 LABCELL_X48_Y11_N9 tdcs|tdc[0].tdc|tdc|le|phase|d|inst6|dataf
16.422   0.080 FF CELL 2 LABCELL_X48_Y11_N9 tdcs|tdc[0].tdc|tdc|le|phase|d|inst6|combout
16.626   0.204 FF IC 1 LABCELL_X48_Y11_N6 tdcs|tdc[0].tdc|tdc|le|phase|d|inst7|dataf
16.708   0.082 FF CELL 2 LABCELL_X48_Y11_N6 tdcs|tdc[0].tdc|tdc|le|phase|d|inst7|combout
16.926   0.218 FF IC 1 LABCELL_X48_Y11_N3 tdcs|tdc[0].tdc|tdc|le|phase|d|inst8|dataf
17.006   0.080 FF CELL 2 LABCELL_X48_Y11_N3 tdcs|tdc[0].tdc|tdc|le|phase|d|inst8|combout
17.217   0.211 FF IC 1 LABCELL_X48_Y11_N0 tdcs|tdc[0].tdc|tdc|le|phase|d|inst9|datad
17.568   0.351 FF CELL 2 LABCELL_X48_Y11_N0 tdcs|tdc[0].tdc|tdc|le|phase|d|inst9|combout
18.294   0.726 FF IC 1 LABCELL_X48_Y10_N57 tdcs|tdc[0].tdc|tdc|le|phase|e|inst0|dataf
18.373   0.079 FF CELL 2 LABCELL_X48_Y10_N57 tdcs|tdc[0].tdc|tdc|le|phase|e|inst0|combout
18.668   0.295 FF IC 1 LABCELL_X48_Y10_N54 tdcs|tdc[0].tdc|tdc|le|phase|e|inst1|dataf
18.750   0.082 FF CELL 2 LABCELL_X48_Y10_N54 tdcs|tdc[0].tdc|tdc|le|phase|e|inst1|combout
18.970   0.220 FF IC 1 LABCELL_X48_Y10_N21 tdcs|tdc[0].tdc|tdc|le|phase|e|inst2|datad
19.350   0.380 FF CELL 2 LABCELL_X48_Y10_N21 tdcs|tdc[0].tdc|tdc|le|phase|e|inst2|combout
19.687   0.337 FF IC 1 LABCELL_X48_Y10_N18 tdcs|tdc[0].tdc|tdc|le|phase|e|inst3|dataf
19.769   0.082 FF CELL 2 LABCELL_X48_Y10_N18 tdcs|tdc[0].tdc|tdc|le|phase|e|inst3|combout
20.007   0.238 FF IC 1 LABCELL_X48_Y10_N45 tdcs|tdc[0].tdc|tdc|le|phase|e|inst4|dataf
20.087   0.080 FF CELL 2 LABCELL_X48_Y10_N45 tdcs|tdc[0].tdc|tdc|le|phase|e|inst4|combout
20.300   0.213 FF IC 1 LABCELL_X48_Y10_N42 tdcs|tdc[0].tdc|tdc|le|phase|e|inst5|datad
20.653   0.353 FF CELL 2 LABCELL_X48_Y10_N42 tdcs|tdc[0].tdc|tdc|le|phase|e|inst5|combout
20.895   0.242 FF IC 1 LABCELL_X48_Y10_N9 tdcs|tdc[0].tdc|tdc|le|phase|e|inst6|dataf
20.975   0.080 FF CELL 2 LABCELL_X48_Y10_N9 tdcs|tdc[0].tdc|tdc|le|phase|e|inst6|combout
21.179   0.204 FF IC 1 LABCELL_X48_Y10_N6 tdcs|tdc[0].tdc|tdc|le|phase|e|inst7|dataf
21.261   0.082 FF CELL 2 LABCELL_X48_Y10_N6 tdcs|tdc[0].tdc|tdc|le|phase|e|inst7|combout
21.498   0.237 FF IC 1 LABCELL_X48_Y10_N33 tdcs|tdc[0].tdc|tdc|le|phase|e|inst8|dataf
21.578   0.080 FF CELL 2 LABCELL_X48_Y10_N33 tdcs|tdc[0].tdc|tdc|le|phase|e|inst8|combout
21.783   0.205 FF IC 1 LABCELL_X48_Y10_N30 tdcs|tdc[0].tdc|tdc|le|phase|e|inst9|dataf
21.865   0.082 FF CELL 2 LABCELL_X48_Y10_N30 tdcs|tdc[0].tdc|tdc|le|phase|e|inst9|combout
21.865   0.000 FF IC 1 FF_X48_Y10_N31 tdcs|tdc[0].tdc|tdc|le|phase|e|latch[9]|d
22.127   0.262 FF CELL 1 FF_X48_Y10_N31 TDCn:tdcs|TDC2ef:tdc[0].tdc|TDC2e:tdc|TDC1:le|TDClcell80:phase|TDClcell10:e|latch[9]
</pre>

Latest revision as of 18:44, 7 September 2024

DL-TDC DarkLight FPGA TDC

ODB settings

  • dl_enable - yes/no - enable or disable TDC readout in the midas frontend
  • dl_ctrl - 32 bits of general control
bit - quartus - description
  0 - dl_ctrl_gate   - jam TDC gate open, enable un-triggered free-running mode
  1 - dl_ctrl_gate_A - gate TDC from A-side trigger
  2 - dl_ctrl_gate_B - gate TDC from B-side trigger
  3 - dl_ctrl_gate_AB - gate TDC from A*B
  4 - dl_ctrl_gate_T - gate TDC from T trigger (T = A*B)
  5 - dl_ctrl_ena_A - enable TDC channel 32 (A)
  6 - dl_ctrl_ena_B - enable TDC channel 33 (B)
  7 - dl_ctrl_ena_T - enable TDC channel 34 (T)
15..8 - dl_ctrl_gate_w - TDC gate width in units of 8 ns
31..16 - not used
  • dl_trg_mask - 16 bits of trigger mask
bit - description
  0 - enable A pair 1-9
  1 - enable A pair 2-10
  2 - enable A pair 3-11
  3 - enable A pair 4-12
  4
  5
  6
  7
  8 - enable B pair 5-13
  9 - enable B pair 6-14
 10 - enable B pair 7-15
 11 - enable B pair 8-16
  • dl_tdc_mask - 32 bits to enable 32 TDC channels, in sequence

Channel map

// map TDC cable to SiPM channels
   
   assign ch[1]  = tdc[0];
   assign ch[2]  = tdc[1];
   assign ch[3]  = tdc[10];
   assign ch[4]  = tdc[11];
   assign ch[5]  = tdc[2];
   assign ch[6]  = tdc[3];
   assign ch[7]  = tdc[8];
   assign ch[8]  = tdc[9];

   assign ch[9]  = tdc[15];
   assign ch[10] = tdc[14];
   assign ch[11] = tdc[7];
   assign ch[12] = tdc[6];
   assign ch[13] = tdc[13];
   assign ch[14] = tdc[12];
   assign ch[15] = tdc[5];
   assign ch[16] = tdc[4];

   assign ch[16+1]  = tdc[16+0];  // 16
   assign ch[16+2]  = tdc[16+1];  // 17
   assign ch[16+3]  = tdc[16+10]; // 26
   assign ch[16+4]  = tdc[16+11]; // 27
   assign ch[16+5]  = tdc[16+2];  // 18
   assign ch[16+6]  = tdc[16+3];  // 19
   assign ch[16+7]  = tdc[16+8];  // 24
   assign ch[16+8]  = tdc[16+9];  // 25

   assign ch[16+9]  = tdc[16+15]; // 31
   assign ch[16+10] = tdc[16+14]; // 30
   assign ch[16+11] = tdc[16+7];  // 23
   assign ch[16+12] = tdc[16+6];  // 22
   assign ch[16+13] = tdc[16+13]; // 29
   assign ch[16+14] = tdc[16+12]; // 28
   assign ch[16+15] = tdc[16+5];  // 21
   assign ch[16+16] = tdc[16+4];  // 20

   // compute SiPM pair concindences
   
   assign A[0] = ch[1] & ch[9]  & enable_input[0]; //  0 * 15 -> pair1
   assign A[1] = ch[2] & ch[10] & enable_input[1]; //  1 * 14 -> pair2
   assign A[2] = ch[3] & ch[11] & enable_input[2]; // 10 *  7 -> pair3
   assign A[3] = ch[4] & ch[12] & enable_input[3]; // 11 *  6 -> pair4
   assign A[4] = ch[5] & ch[13] & enable_input[4];
   assign A[5] = ch[6] & ch[14] & enable_input[5];
   assign A[6] = ch[7] & ch[15] & enable_input[6];
   assign A[7] = ch[8] & ch[16] & enable_input[7];

   assign B[0] = ch[16+1] & ch[16+9]  & enable_input[8];  // 16 * 31
   assign B[1] = ch[16+2] & ch[16+10] & enable_input[9];  // 17 * 30
   assign B[2] = ch[16+3] & ch[16+11] & enable_input[10]; // 26 * 23
   assign B[3] = ch[16+4] & ch[16+12] & enable_input[11]; // 27 * 22
   assign B[4] = ch[16+5] & ch[16+13] & enable_input[12]; // 18 * 29 -> pair5
   assign B[5] = ch[16+6] & ch[16+14] & enable_input[13]; // 19 * 28 -> pair6
   assign B[6] = ch[16+7] & ch[16+15] & enable_input[14]; // 24 * 21 -> pair7
   assign B[7] = ch[16+8] & ch[16+16] & enable_input[15]; // 25 * 20 -> pair8

   wire        A_or = |A;
   wire        B_or = |B;

   //wire        A_or = A[0] | A{1] | A{2] | A[3] | A[4] | A{5] | A{6] | A[7];
   //wire        B_or = B[0] | B{1] | B{2] | B[3] | B[4] | B{5] | B{6] | B[7];

   wire        AB_and = A_or & B_or;

D3 delay tuning

  • quartus report "DL trigger GPIO to dlA", "to dlB" and "through dlT"
  • delay values are set in quartus assignements file. Delay values go from 0 to 7 in increments of about 0.5 ns.
dsdaqgw:chronobox_firmware$ grep D3_DELAY *.qsf
DE10_NANO_SoC_GHRD.qsf:set_instance_assignment -name D3_DELAY 5 -to GPIO_1_21
9.109	GPIO_1_20	dl|WideOr0|combout -> 1
9.025	GPIO_1_33	dl|WideOr0|combout -> 1
9.022	GPIO_1_26	dl|WideOr0|combout -> 0
8.966	GPIO_1_28	dl|WideOr0|combout -> 5            = 8.494 add 1
8.787	GPIO_1_22	dl|WideOr0|combout -> 0
8.714	GPIO_1_21	dl|WideOr0|combout -> 5
8.711	GPIO_1_34	dl|WideOr0|combout -> 0
8.597	GPIO_1_30	dl|WideOr0|combout -> 0            = 8.240 add 1 -> 1 = 9.733 sub 1
8.590	GPIO_1_29	dl|WideOr0|combout -> 1 add 1 -> 2 = 9.588 sub 1
8.506	GPIO_1_27	dl|WideOr0|combout -> 4 add 1 --------------------> 5 = 10.097 sub 1
8.453	GPIO_1_24	dl|WideOr0|combout -> 2 add 1 -> 3 = 9.588 sub 1
8.412	GPIO_1_35	dl|WideOr0|combout add 1
8.380	GPIO_1_31	dl|WideOr0|combout -> 4 add 1 -> 5 = 9.208 sub 1
8.312	GPIO_1_25	dl|WideOr0|combout -> 1 add 1 -> 2 = 8.555 add 1 -> 3 = 9.379
7.992	GPIO_1_32	dl|WideOr0|combout add 2
7.248	GPIO_1_23	dl|WideOr0|combout -> 2 add 3 -> 5 = 9.425 sub 1
9.339	GPIO_0_14	dl|WideOr1|combout -> 6 sub 1 -> 5 = 8.587
9.207	GPIO_0_2	dl|WideOr1|combout -> 7 sub 1 -> 6 = 8.360 add 1
9.174	GPIO_0_10	dl|WideOr1|combout -> 6
9.161	GPIO_0_6	dl|WideOr1|combout -> 7
9.105	GPIO_0_11	dl|WideOr1|combout -> 7
9.019	GPIO_0_7	dl|WideOr1|combout -> 7
8.731	GPIO_0_15	dl|WideOr1|combout add 0 -> 0 = 8.540 add 1
8.462	GPIO_0_12	dl|WideOr1|combout add 1 -> 1 = 9.189
8.256	GPIO_0_4	dl|WideOr1|combout add 2 -> 2 = 9.750 sub 1
8.214	GPIO_0_5	dl|WideOr1|combout add 2
8.182	GPIO_0_1	dl|WideOr1|combout add 2
7.328	GPIO_0_3	dl|WideOr1|combout add 3
6.584	GPIO_0_8	dl|WideOr1|combout add 5
6.409	GPIO_0_13	dl|WideOr1|combout add 5 -> 5 =  9.943 sub 2
6.009	GPIO_0_9	dl|WideOr1|combout add 6 -> 6 = 10.189 sub 2
5.917	GPIO_0_0	dl|WideOr1|combout add 6

Theory of operation

Why FPGA TDC?

  • combine trigger logic, hit recording and time measurement in one device
  • avoid having to split signals to FPGA trigger and to external TDC and to coordinate clocks and timestamps between them
  • ability to construct custom TDC with data paths tuned to experiment requirements, i.e. ultra high data rates. this avoids the well known problem with the CERN TDC ASIC (V1190) where high rate on one channel will cause data loss on other channels.
  • ability to get the data out at FPGA speeds, not limited to VME, USB or Ethernet speeds.
  • ability to "right-size" the TDC. ASIC TDCs come in fixed increments: 96 channels (Lecroy Fastbus TDC), 64 or 128 channels (CAEN V1190 VME TDC), 64 channels (PicoTDC), overkill of fewer channels are actually needed. Compared to FPGA TDC where size (cost) of FPGA can be selected according to need and where FPGAs of different sizes often are available as interchangeable plug-in modules.

Downsides:

  • ASIC TDC design can control internal timing much better than an FPGA TDC. as result per-time-bin and per-channel variations can be made much smaller.
  • ASIC TDC can run at much higher clock frequencies and have much smaller time bins.
  • ASIC TDC may have internal temperature compensation functions in order to avoid temperature drift of TDC calibration.

Types of FPGA TDC

FPGA TDC come in two basic types: based on delay lines and based on the Vernier method. Delay line TDC resolution is limited to size and number of delay line elements. Vernier TDCs requires precise clock generators (usually not available on standard FPGA devices). Delay line TDCs have several designs. Delay line captures phase of input signal relative to the clock. Delay line captures phase of the clock relative to the input signal. Delay line encoder looks for 1 edge transition, or looks for many edge transitions ("wavelet TDC").

Delay line FPGA TDC building blocks

  • signal capture and clock synchronizer - asynchronous input signal is latched and synchronized to the TDC clock. Per-hit dead time (LE to next pulse), minimum pulse width requirement (LE to TE), minimum time double-pulse resolution (TE to next LE) are created here.
  • tdc clock counter - latched and synchronized input signal records the hit coarse time (10 ns time bin)
  • delay line - tdc clock (50 MHz/20 ns) waveform travels throught the 60-element delay line (~25 ns) total delay), latched input signal captures this waveform in the phase latch register (60 bits). Typical bit pattern: "00...000111...11100..000"
  • "temperature encoder" - looks for the position of the first 0->1 or 1->0 transition and converts it into a time bin number 1..60 (for 0->1 transitions) and -1..-60 (for 1->0 transitions). This clock phase time bin number corresponds to the TDC fine time. After calibration that accounts for individual delay of each time bin.
  • per-channel input buffer - 64 hits per channel for LE and TE (32 LE+TE hits), to handle bursts of hits
  • main multiplexor - data from 32+3 TDC channels is funneled into 1 output stream
  • main data FIFO - "the bigger, the better" data buffer to hold the data before it is transmitted out of the TDC
  • data transmitter - DL-TDC uses a MIDAS frontend to read the main data FIFO via a 64-bit AXI bus, package data as MIDAS events and send them to the main computer via the Cyclone-5 SoC 1gige ethernet (data rate about 50 Mbytes/sec; at 8+8 bytes per TDC hit (LE+TE), about 3 Mhits/sec, sustained).

Implementation details

  • delay line element: use LCELL or cyclonev_lcell_comb (TDClcellff.sv), quartus fitter does not care which, does it's own thing regarding which LCELL input ports to use. Input "F" must be used for best timing (shortest delay): LUT mask: F0 = vcc 0xFFFF, F1 = vcc 0xFFFF, F2 = gnd 0x0000, F3 = gnd 0x0000, Combout equation: LCELL(F), File:TDC LCELL.pdf
  • delay line: in theory, 20 delay line elements can be packed in a 10-ALM block. In practice, to ensure routing uses LCELL input "F", TDC uses 8 delay elements per 10-ALM block. (quartus uses the "leftover" ALMs to implement the encoder and other logic). Typical timing reported by quartus is 0.087 ns transmit time through combinatorial logic from input F to COMBOUT output, 0.250 ns transit time to the next delay element inthe same 10-ALM block, 0.800 ns transmit time to the first delay element of the next 10-ALM block. File:TDC DELAY CHAIN1.pdf and File:TDC DELAY CHAIN2.pdf
  • timing of TDC delay chain for each TDC channel is shown in "Report DL-TDC-NN-{LE,TE}", use "Locate path" to "Locate path in chip planner", them zoom in and click in logic elements to examine the physical layout. Use "show routing" to see more detail of connection between logic elements.
  • layout of the 60-element TDC delay line is done manually using quartus qsf file dltdc.qsf. This file is generated by a perl script (dltdc_qsf.perl). Location of each TDC channel is selected manually and must be adjusted to have them close to the FPGA input pins and to spread things around to avoid FPGA resource congestion.
set_location_assignment LABCELL_X11_Y10_N6 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[0].c|lcell"
set_location_assignment FF_X11_Y10_N7 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[0].c|ff1"
set_location_assignment LABCELL_X11_Y10_N12 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[1].c|lcell"
set_location_assignment FF_X11_Y10_N13 -to "TDCn:tdcs|TDC2ef:tdc[17].tdc|TDC2e:tdc|TDC1:le|TDClcellN:phase|TDClcellff:e[1].c|ff1"
  • Cyclone-V SoC FPGA on the DE-10 evaluation board comfortably fits 32+3 TDC channels with room to spare: File:TDC LAYOUT.pdf (each TDC channel is shown in a different colour, explosion at the paint factory)

TDC calibration

  • the DL-TDC design uses the delay line for the clock and the latched hit signal to capture the clock phase. if TDC hits are uncorrelated with the TDC clock (i.e. cosmic rays or calibration pulser running from a different clock oscillator), we can assume a uniform distribution of TDC fine time (0 to 10 ns) and use the TDC fine time bin distribution to compute actual TDC delay line bin size and construct the mapping from TDC fine time bin (1..60) to TDC fine time (0..10 ns).
  • calibration pulser run 286, TDC firmware 0x66dbbf18
  • channel tdc00-LE fine time bin occupancy distribution: File:TDC TIME BIN OCCUPANCY.pdf
  • fine time bin size (actual bin size is smaller than bin size computed by quartus because quartus must assume the worst possible FPGA timing): File:TDC TIME BIN SIZE.pdf
  • typical TDC delay line size is 45-50 bins (out of 60 available), average time bins size 0.200..0.222 ns, actual computed typical bin size 0.180 ps (or so) with 5 or 6 extra-wide bins that correspond to TDC delay line transit from one block of logic elements to the next block of logic elements.
  • for each run the fine time distribution is computed, if distortion from uniform 0..10 ns becomes too big, fine time calibration must be redone. File:TDC FINE TIME.pdf
  • in addition to TDC delay line calibration, the TDC per-channel input delays must be calibrated. this is done by sending a common signal to all TDC inputs: File:TDC PULSER LE.pdf

Future improvement 1

FPGA TDCs that use LCELL delay lines are unusual. Most FPGA TDCs reported on the literature use CARRY-chain delay lines.

Typical LCELL delay is 0.200 ns, typical CARRY delay is .050 ns (even for very old Cyclone-I FPGAs) and TDCs with much higher nominal resolution can be built.

The trade-off between the two designs is the interplay between length of the delay line and frequency of the TDC fine clock. Slow clock and very fast delay line result in a very long delay line. Very long delay lines require edge ("temperature") encoders that use too many logic elements and this limits the number of channels that can be implemented in an FPGA of given size.

The DL-TDC uses a 100 MHz fine time clock which is typical of FPGA logic designs used at TRIUMF (i.e. state of the art DarkSide FPGA logic runs only just faster at 125 MHz). Coupled with 0.200 ns LCELL delay this yields 50-60 element delay lines that comfortably fit inside the FPGA and use encoders that need only 1 level of pipelining to meet the timing. FPGA compilation time is 20 minutes (AMD 7700 CPU with DDR5 memory). A well balanced design. The fairly low time resolution (0.2 ns time bin vs 0.1 ns time bin of very old V1190 TDC) is deemed adequate to resolve the 1.5 ns e-linac bunches.

For better time resolution a CARRY chain TDC must be developed:

  • faster TDC fine clock, 200-500 MHz
  • keep delay line length under 50-60 time bins
  • keep the TDC back-end (endoder, data buffers, multiplexors) on the TDC slow clock (100-125 MHz)

Future improvement 2

The Cyclone-V SoC FPGA is now very old and is no longer a flagship at Altera (now Intel). It is still available, but for how long? Better, bigger, faster FPGAs are now available.

Next step would be to finish converting the TDC design to system-verilog and to port it to the Xilinx FPGA architecture.

Secret Sauce

Yea, right. Ask me.